State-of-the-art Surface Mount Technology board assembly
Sellectronics’ Surface Mount Technology board assembly lines are the state-of-the-art systems that are capable of placing over 34,000 components per hour (CPH).
Working with passive devices down to 01005 and BGA & µBGA (0.3mm) using lead-free solder paste and Automatic Optical Inspection (AOI) at every stage, engineers ensure that the quality of finished products is of the highest quality.
Supported with both conventional and Vapour Phase reflow ovens, Sellectronics can solder the most detailed products to the highest quality possible.
With the ability to run 24/7 over three shifts, Sellectronics has the capacity to handle your products, and much, much more.